Quantum
Quantum & Electronics Bonders
CSIRO Lindfield | Sydney, NSW
Exclusive to the Defence Trailblazer Proto-Lab Network, state-of-the-art specialist equipment packages at CSIRO facilities support the prototyping and delivery of R&D commercialisation projects.
CSIRO Lindfield houses three pieces of equipment (a state-of-the-art wire bonder, a flip-chip bonder and a surface preparation tool) that offer flexibility to assemble and prototype quantum computing and electronic device components. The equipment at this facility includes the following:
- Hesse Bondjet BJ653
- SET FC150 Flip-Chip Bonder
- OntosTT Surface Preparation Tool
For Defence Trailblazer industry partners and program participants, as well as UoA and UNSW staff members, specified equipment operated by CSIRO for Defence Trailblazer can be accessed at a subsidised rate which covers operating labour and equipment maintenance.
Users will be required however, to either provide or fund approved consumables and any additional services such as design services or technical files that are provided by CSIRO.
Quotes for consumables and additional services can be provided by CSIRO’s equipment operators on request and, if accepted by the user, will be documented in an agreement between CSIRO and the user.
The Defence Trailblazer Proto-Lab Network Manager can facilitate introductions to CSIRO’s equipment operators on request. Please contact us at protolab@dtb.solutions for an introduction.
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